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TVS Diode Arrays (SPA ? Family of Products)
Lightning Surge Protection - SPLV2.8-4 Series
Product Characteristics
Soldering Parameters
Lead Plating
Matte Tin
Re?ow Condition
- Temperature Min (T s(min) )
Pb – Free assembly
150°C
Lead Material
Copper Alloy
Pre Heat
- Temperature Max (T s(max) )
200°C
Lead Coplanarity
Substitute Material
Body Material
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
- Time (min to max) (t s )
Average ramp up rate (Liquidus) Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
60 – 180 secs
5°C/second max
5°C/second max
Flammability
Notes :
UL 94 V-0
Re?ow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold ?ash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte ?nish VDI 11-13.
Peak Temperature (T P )
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
Time 25°C to peak Temperature (T P )
Do not exceed
260 +0/-5 °C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
T P
t P
Critical Zone
T L
T S(max)
Ramp-up
t L
T L to T P
Ramp-down
Preheat
T S(min)
t S
25
time to peak temperature
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
Package
Pins
JEDEC
Millimetres
SOIC
8
MS-012
Time
Inches
L F
o
Recommended
Soldering Pad Outline
(Reference Only)
A
A1
A2
B
c
D
E
E1
Min
1.35
0.10
1.25
0.31
0.17
4.80
5.80
3.80
Max
1.75
0.25
1.65
0.51
0.25
5.00
6.20
4.00
Min
0.053
0.004
0.050
0.012
0.007
0.189
0.228
0.150
Max
0.069
0.010
0.065
0.020
0.010
0.197
0.244
0.157
e
1.27 BSC
0.050 BSC
?2012 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
145
Revision: March 20, 2012
L
0.40
1.27
0.016
0.050
SPLV2.8-4 Series
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